AMD SP6 socket for next-gen Zen4 EPYC series has been pictured, same size as SP3

AMD SP5 socket has been confirmed

It didn’t take long for the rumors about AMD’s next-gen SP6 socket to already find a confirmation through newly leaked photos.

Over at AnandTech forums one can find photos and schematics for the socket codenamed SP6. This socket has been explained in leaked slides as a platform for edge and telco systems, therefore, where power optimizations are just as crucial as performance. According to those slides, this socket would support up to 32-core Genoa (Zen4) EPYC processors and up to 64-core Bergamo (Zen4c) series. The power would also be limited to 225W, which is nearly half of what the full SP5 socket can support.

AMD SP6 (LGA4844), Source: SteinFG

The SP6 socket looks more or less the same as the SP3 socket for the current Milan series. In fact, the size is identical (58.5 x 75.4 mm), however the SP6 has a different LGA package with 4844 contact pins. That’s a significant reduction from 6096 for the SP5 socket.

  • Socket SP3 – LGA 4094 -58.5 x 75.4 mm
  • Socket SP5 – LGA 6096 – 76.0 x 80.0 mm
  • Socket SP6 – LGA 4844 -58.5 x 75.4 mm

It goes without saying, but SP6, SP5 and SP3 processors will not be compatible with each other. This also means that AMD has to make two different EPYC Genoa/Turin series for each socket.

This document defines the requirements for a 4844-position, 0.94 mm × 0.81 mm interstitial pitch, surface-mount land-grid array (SM-LGA) socket—herein referred to as the Socket SP6—for use with the AMD 4844-position organic land grid array (OLGA) package that has substrate dimensions of 58.5 mm × 75.4 mm. The Socket SP6, shown in Figure 1, is designed to provide a reliable electrical interconnect between the printed circuit board (PCB) and the 4844 land pads of the OLGA package throughout the life of the product.

— SteinFG, AnandTech Forums

AMD SP6 (LGA4844), Source: SteinFG

One of our readers made a suggestion that 4th Gen EPYC series could now be divided into high-performance 7004 series and efficiency-focused EPYC 5004 CPUs, which makes a lot of sense. Furthermore, the latter option could open more possibilities for AMD to engage the consumer HEDT market.

RUMORED AMD EPYC Processor Series Specifications
VideoCardz 3rd Gen EPYC
“Milan / Milan-X

4th Gen EPYC
“Genoa / Genoa-X
4th Gen EPYC
5th Gen EPYC “Turin” launch 2021 2022
2022 2023/2024 architecture 7nm Zen3 5nm Zen4
5nm Zen4c Zen5 socket
SP3 (LGA4094)
SP5 (LGA-6096)
SP6 (LGA-4844)
SP5 (LGA-6096)
SP6 (LGA-4844)
SP5 (LGA-6096) SP6 (LGA-4844) Modules / Chiplets 8xCCD + 1xIOD 12xCCD + 1xIOD
TBC TBC Max Colors 64C / 128T 96C / 192T
128C / 256T 256C / 512T L2 Cache Per Core 0.5 MB 1 MB
TBC TBC L3 Cache Per CCX 32MB / 96MB
32 MB / ?? MB TBC
Memory Channels
12-channel (SP5)
6-channel (SP6)
12-channel (SP5) 6-channel (SP6) 12-channel (SP5) 6-channel (SP6) Memory Support
DDR4-3200 DDR5-5200 DDR5-5200
PCIe Lanes
128x Gen4
160x Gen5 (SP5)
96x Gen5 (SP6) 160x Gen5 (SP5) 96x Gen5 (SP6)
Max cTDP
200-400W (SP5)

70-225W (SP6) 200-400W (SP5)

70-225W (SP6)TBCSource: AnandTech Forums via@Olrak29_

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